ISTAMPING

Beryllium Copper Materials

Beryllium copper C17200 is the reference alloy when a stamped part has to carry current and hold a spring force at the same time - battery and charging contacts, EMI grounding fingers, relay springs and connector terminals that must survive millions of mating cycles without relaxing. C17200 reaches roughly 1100-1300 MPa in the aged temper, several times the strength of pure copper, while still conducting 22-28% IACS, and it keeps that spring force through solder reflow and thermal cycling where phosphor bronze softens and pure copper simply yields.

ISTAMPING stamps C17200 and other beryllium copper grades from 0.05 to 3.0 mm on 25-110 ton presses at ±0.005 mm positioning accuracy, with the temper and grain direction specified against the forming direction because the alloy's spring properties are directional. In-die sensing protects fine contact fingers at speed, and burrs are held to ≤0.05 mm so the contact faces stay clean. Post-stamp age hardening and any nickel, tin or selective gold plating run through managed partner lines with hardness, film thickness and salt-spray verification on every lot.

Key Properties

PropertyValue
Strength≈1100-1300 MPa in the aged temper - the highest of the copper-based spring alloys
Conductivity≈22-28% IACS - the trade-off C17200 makes for its spring force
Fatigue LifeHolds spring force across millions of cycles; the standard choice for wearing contacts
Thermal StabilityRetains spring properties through reflow and thermal cycling
FormabilityStamped 0.05-3.0 mm; working direction and bend radii set per temper

Typical Applications

  • Battery and charging contacts
  • EMI grounding fingers and shields
  • Relay and switch springs
  • Connector and socket terminals
  • Test-probe and instrument contacts
  • High-reliability medical and industrial contacts

Common Alloys

C17200 (BeCu 1.9%), C17510 (BeCu high-conductivity grade), C17300 (free-machining BeCu)

Finishing & Coatings

  • Nickel plating (wear & diffusion barrier)
  • Tin plating (solderability)
  • Selective gold plating on contact faces
  • Post-stamp age hardening via managed partner lines

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