Lead Frames — Fine Pitch down to 0.4 mm
Lead frames are precision stamped metal carriers used in semiconductor packaging - providing the electrical connection path between the die and the external circuit.
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Performance
FINE-PITCH PRECISION
Lead frame quality is defined by feature pitch accuracy, burr control and flatness - all critical for die-attach and wire-bonding processes. Our 0.005 mm positioning precision and managed selective plating (silver, tin) deliver lead frames that perform in the most demanding packaging environments.
Fine-pitch leadframe features demand ultra-precision stamping, material expertise and strict flatness control.
ISTAMPING produces ultra-precision stamped lead frames and leadframe IC components with 0.005 mm accuracy on high-speed presses with automated feeding, in copper alloys, Alloy 42 and phosphor bronze - the leading frame solution for high-pin-count semiconductor packages.
Materials
Common Materials
- C194 / C7025 High-Performance Copper
- C5191 Phosphor Bronze
- Alloy 42 (Fe-Ni)
- C1100 Copper
Specifications
Technical Specifications
Material thickness
0.10 – 0.50 mm
Positioning precision
±0.005 mm
Pitch / feature
Fine-pitch down to 0.4 mm
Press capacity
25 – 80 tons (high-speed)
Production speed
Up to 300 SPM
Plating
Selective silver / tin / nickel
Product Range
Types of Lead Frames We Produce
The form factors below are the ones we run most often on coil-fed progressive dies — tell us yours if it is not listed.
QUALITY ASSURANCE & INSPECTION
Rigorous Precision Inspection & Quality Control Standards
Inspection HardwareHigh-Precision Testing Equipment
- ZEISS CMM for complex 3D contours
- Nikon optical projector & tool presetters (0.001 mm resolution)
- Vickers hardness testers & surface roughness gauge
Quality StandardsInspection Built Into Every Run
- 100% critical dimension inspection before packaging & shipment
- Concentricity & runout verification under optical magnifiers
- Surface micro-scratch & polish quality double-check
Material ComplianceFull Material & Heat Treatment Traceability
- Spectrometer material composition analysis report provided
- Original Mill Test Certificate (MTC) & heat treatment logs
- RoHS & REACH environmental compliance statements
Talk to Our Engineers About Quality Documentation
Tell us what your project requires, and our team confirms which inspection and material documentation can be included with your quote.
Manufacturing Process
How We Manufacture Lead Frames
From drawing review to delivered parts — die design, stamping, plating and inspection records all owned in-house.
IC Package Role
A lead frame is the metal carrier that provides the electrical path between the semiconductor die and the external circuit, and a mechanical skeleton for molding. We engineer frames for wire-bond and clip-bond packages.
Stamping vs Etching
For high-volume, thin, high-conductivity frames we use high-speed progressive stamping - higher throughput and lower unit cost than chemical etching, with superior edge quality and dimensional repeatability.
Fine-Pitch Progressive Tooling
Precision progressive dies built 100% in-house form leads and tie bars at ±0.005 mm, holding fine pitch down to 0.4 mm across long runs.
High-Speed Stamping
Lead frames are stamped on high-speed presses with automated feeding and in-process monitoring, up to 300 SPM with burr-free edges.
Selective Plating
Reel-to-reel selective silver or tin plating is applied only on bonding and soldering areas, controlling cost while meeting electrical and reliability specs.
Flatness and Tie-Bar Design
Die-attach and wire-bonding tolerate almost no out-of-flat variation, so tie-bar geometry, carrier rail design and stress release during blanking are engineered together. Frames ship on tape or lay-flat with crossection and camber verified per lot.
Cleanroom Inspection
Dimensional and visual inspection under IATF 16949:2016 - including cleanroom handling for sensitive packages - verifies flatness and burr control before shipment.
Applications
Where Lead Frames Are Used
Each card opens the industry page for that application — programs, materials and controls by sector.
Electronics
QFN / DFN / UDFN fine-pitch IC packages — Consumer and industrial electronics require ever-smaller, ever-more-precise stamped components…
Electrical
SOP / QFP microcontroller & power packages — Electrical metal stamping for power distribution - copper and aluminum busbars, silver and nickel plated contacts…
Electronics
Sensor & MEMS device lead frames — Consumer and industrial electronics require ever-smaller, ever-more-precise stamped components…
Automotive
Automotive semiconductor packaging — The automotive industry is our most demanding and most important market.
Electronics
Consumer electronics & IoT chips — Consumer and industrial electronics require ever-smaller, ever-more-precise stamped components…
Electronics
Power device & clip-bond packages — Consumer and industrial electronics require ever-smaller, ever-more-precise stamped components…
In-House Tool Room
Made in Our Own Tool Room
Every progressive die behind our stamped parts is 100% in-house stamping tooling — design, machining, assembly and T1 trial all under our roof. That is why tooling issues get solved on the shop floor in hours, not by email exchange with an outside die shop.
±0.001 mm Achieved
Combined machining accuracy down to ±0.001 mm, Ra0.05 µm surfaces and Ø0.05 mm micro end mills for tight die features.
30 In-House Machines
30 die-making machines — wire EDM, CNC and precision grinding — keep every die build and repair on our own schedule.
2–5 Weeks for Stamp Dies
Typical stamping die delivery in 2–5 weeks, with T1 trials run on our own presses before you commit to volume.
One Accountable Chain
Self-designed progressive dies, machined in-house, run at 60–300 SPM with CCD inline inspection — no outsourced-die handoff where quality falls between suppliers.
INSIDE THE PLANT
Inside Our Stamping Line
Real equipment and inspection floor from our Dongguan plant — 25–110T high-speed presses, in-house tool room, and a CMM lab running first-article inspection on every program.
Engineering Support
Design-for-Manufacturability Support
Our engineers review your lead frame at the quoting stage - pad geometry, pitch, material grade and plating zones - and recommend design-for-manufacturability changes that improve yield and lower tooling cost. Existing dies can be taken over and optimized for our high-speed presses. For the process decision itself, see our lead frame etching vs stamping comparison, the lead frame surface-mount, tolerance & alloy selection guide.
FAQ
Questions Buyers Ask
Straight answers on materials, plating, supply format, quality and timing — send your drawing for anything specific.
What is a lead frame used for?
A lead frame carries the electrical connection between the IC die and the external circuit, and provides the mechanical structure for packaging. We produce frames for wire-bond and clip-bond semiconductor packages.
Stamping or etching for lead frames?
For high-volume thin, high-conductivity frames, high-speed stamping offers higher throughput, lower unit cost and better edge quality than chemical etching - our standard approach.
What materials and pitch can you hold?
We stamp C194/C7025 copper alloys, phosphor bronze and Alloy 42 at ±0.005 mm precision, with fine pitch down to 0.4 mm standard and 0.25 mm lead pitch program-dependent.
How are lead frames packaged for the assembly line?
Frames ship on tape or lay-flat per your die-attach equipment, with flatness (camber and crossection) verified per lot and cleanroom handling for sensitive packages.
Which is cheaper for high volume: stamped or etched lead frames?
Above roughly tens of thousands of units, progressive stamping wins on throughput and cost per pin, and it holds tighter flatness on copper alloys; etching stays the right call for complex 2.5-D geometries and very low volumes. Our comparison guide breaks down the crossover point.
What drawing file formats do you accept?
PDF, STEP, IGES, DWG or DXF — send whatever you have with material, annual volume and target tolerance, and your drawing goes straight to our engineering team for a DFM pass. No finished drawing yet? A photo of the part or a sketch with a few key dimensions is enough to start.
NEXT PROGRAM
Spec Your Next Part Here
Sibling part families on the same presses, dies and quality system — one RFQ covers the mix.
Terminals
Spec your terminals on ±0.005 mm dies with selective plating right on the contact faces.
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Wire & Cable Connectors
Hold crimp integrity with fine-pitch dies and plated contact faces, reel-packed.
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Assemblies
Consolidate stamping, plating and assembly under one PPAP and one accountable line.
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