ISTAMPING

High-Conductivity Copper Alloys

High-performance copper alloys solve the classic connector trade-off: pure copper conducts but is soft, spring alloys are strong but lossy. Copper-nickel-silicon grades such as C70250 (Corson type) hold roughly 45-60% IACS at 600-800 MPa, covering most high-current terminal, busbar and micro-pin duties. Where mechanical duty outweighs conductivity, copper-nickel-tin C72900 and titanium copper C19900 push strength and wear resistance further still, the same family of solutions used instead of beryllium copper, and they keep their spring force through soldering heat and millions of flex cycles.

ISTAMPING stamps these high-conductivity copper alloys into EV connector terminals, high-current busbar contacts and micro-terminals down to 0.1 mm strip, on 25-110 ton presses at ±0.005 mm positioning accuracy. Burr heights are held to ≤0.05 mm and in-die sensing protects miniature contact features at speed, with hole-to-thickness and bend radii tuned per grade rather than assumed across the family. Selective or full tin, nickel and silver plating for solderability and contact resistance is managed through approved partner lines with film-thickness and adhesion testing on every lot.

Key Properties

PropertyValue
ConductivityCu-Ni-Si grades such as C70250 run ≈45-60% IACS; strength-first grades trade conductivity for wear life
Strength≈600-800 MPa in Cu-Ni-Si grades, higher still in C72900 and C19900 titanium copper
Thermal StabilityRetains spring force through reflow and solder-dip heat cycles
FormabilityStampable from 0.1 mm strip; hole and bend ratios set per grade and temper
FinishingTin / nickel / silver plating via managed lines; salt-spray and adhesion tested

Typical Applications

  • EV & high-voltage connector terminals
  • High-current busbar contacts
  • Micro-connectors & board terminals
  • Relay & socket spring parts
  • Telecom & datacom contact fingers
  • Lead frames & precision springs

Common Alloys

C70250, C72900, C19900

Finishing & Coatings

  • Tin plating (solderability)
  • Silver plating (low contact resistance)
  • Nickel plating (barrier & wear)
  • Pre-plated strip options (tin/nickel) to skip post-stamp plating

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